Bill of Materials & Sourcing

Stub — section skeleton authored 2026-06-27; prose to follow.

2.1 Compute Platform

2.1.1 Raspberry Pi 5 (8 GB)

The reference build uses a Raspberry Pi 5 with 8 GB LPDDR4X RAM. This section covers the rationale for the 8 GB SKU over the 4 GB, the Pi 5’s FreeCAD-relevant performance characteristics (Cortex-A76 single-thread speed, Videocore VII OpenGL ES 3.1 / Vulkan 1.2), and the Pi 5’s power input requirements that the Joy-it step-down module must satisfy.

2.1.2 Joy-it Raspberry Pi 5 Cooler

The reference build uses a Joy-it aluminum case/heatsink assembly rated for the Pi 5. This section covers the thermal dissipation characteristics, mounting procedure on the Pi 5, and the case’s compatibility with the DFCD chassis dimensions.

2.2 Display

2.2.1 10.1-inch IPS Touch LCD

The reference build uses a 10.1-inch IPS touch LCD. This section covers the panel specification (resolution [VERIFY], brightness, touch protocol), the display’s HDMI input, and its physical dimensions as they constrain the sliding rail design.

2.2.2 Micro HDMI to Ribbon Cable Assembly

The Pi 5’s micro-HDMI output is routed to the display via a 90-degree micro HDMI connector terminating in a 50 cm flexible ribbon cable. This section covers the assembly, the 90-degree adapter geometry as it fits within the chassis, and any signal-integrity considerations at this cable length.

2.3 Keyboard

2.3.1 NOS 450 TKL Mechanical Keyboard

The NOS 450 TKL is the keyboard in the reference build. “TKL” denotes tenkeyless — no numpad — which is the format that fits beneath the sliding screen in the DFCD chassis. This section covers the keyboard’s dimensions, the switch type [VERIFY], the USB interface, and the physical integration into the sliding mechanism that conceals it beneath the display.

2.4 Trackball

2.4.1 Harvested Logitech Marble Electronics

The trackball module in the reference build uses electronics harvested from a Logitech Trackball Marble. This section covers the Marble’s sensor and PCB, the harvest procedure, how the harvested assembly is mounted in the DFCD’s right-side trackball module, and the USB signal routing.

2.4.2 Custom Trackball Electronics (Planned)

The upstream project notes that replacing the harvested Marble electronics with a purpose-built trackball PCB is a future improvement. This section covers the stated design intent and what is known about the custom electronics target at the time of authoring.

2.5 Power System

2.5.1 NP-F Battery (10050 mAh)

The reference build uses an NP-F format battery pack with 10050 mAh capacity and USB-C input for recharging. This section covers the NP-F battery format (the Sony NP-F series form factor widely used in video production), the 7.2 V nominal output voltage, the specific 10050 mAh pack used in the reference build [VERIFY: exact model/vendor], and the contact interface to the step-down module.

2.5.2 Joy-it Step-Down Module (7.2 V → 5.1 V)

The Joy-it step-down module converts the NP-F battery’s 7.2 V output to the 5.1 V required by the Raspberry Pi 5. This section covers the module’s specification (conversion efficiency, output current rating [VERIFY], voltage accuracy), its mounting location in the DFCD chassis, and wiring to the Pi 5’s USB-C or GPIO power input.

2.6 Connectors and Wiring

2.6.1 0B Self-Locking Connectors

Six male/female pairs of 0B self-locking circular connectors are used in the reference build. This section covers their role in the DFCD wiring harness, current and voltage rating [VERIFY], and their physical integration with the rear USB rails and module interfaces.

2.6.2 2B Self-Locking Connector

One 2B self-locking connector pair is used in the reference build. This section notes its location and purpose in the wiring harness.

2.6.3 Y2M 8-Pin Connectors

Two male/female Y2M 8-pin connector pairs are used. This section covers their role in signal routing between modules.

2.6.4 Pogo Pins (GF50-09140-4024)

Two GF50-09140-4024 pogo pins provide spring-loaded electrical contact at a module interface. This section covers the pogo pin specification (contact force, travel, current rating) and their physical location in the chassis.

2.7 Controls and Indicators

2.7.1 Rotary Encoder with Click

A single rotary encoder with integrated pushbutton provides scroll/navigation input. This section covers the encoder specification [VERIFY], its mounting in the chassis, and its software mapping.

2.7.2 Momentary Switches

Three 16 mm momentary switches and one 12 mm momentary switch provide dedicated function inputs. This section covers their placement and function assignments in the reference build.

2.7.3 Tactile Buttons

Ten 12×12 mm tactile buttons provide a secondary input grid. This section covers their layout, function assignments, and PCB integration.

2.7.4 Toggle Switches and Slide Switch

One 6 mm on-on toggle switch, one 6 mm on-off-on momentary toggle switch, and one 2-position slide switch provide mode selection inputs. This section covers their function assignments in the reference build.

2.7.5 LEDs

Four 3 mm LEDs provide status indication. This section covers their color assignments [VERIFY] and what each LED indicates in the reference build.

2.8 Chassis and Print Materials

2.8.1 Material Selection

The reference build uses a 3D-printed chassis. The choice of printing material — PLA, PETG, ASA, or ABS — affects structural integrity in a warm workshop environment, long-term dimensional stability, and post-processing options. This section covers the material used in the reference build [VERIFY from upstream docs] and the tradeoffs for builders choosing a different material.

2.8.2 Print Hardware (Inserts, Fasteners)

Brass heat-set inserts and machine screws are typically used in structural 3D-printed assemblies of this type. This section covers the fastener hardware required for the DFCD chassis [VERIFY from upstream hardware list].

2.9 Sourcing Notes and Substitutions

This section collects cross-cutting sourcing advice: where each category of component is reliably available (global distributors vs. direct-from-manufacturer), lead times to plan around, and which substitutions are viable without modifying the chassis design.